Agentic AI Prevents Costly Machine Downtime in Factories and Semiconductor Fabs

Things are moving fast in AI space (where no one can hear you scream). For example, I first became aware of the concept of “Agentic AI” only a couple of months ago as I pen these words. Now, I find that this bodacious beauty is already being deployed in factories and semiconductor fabs to transform manufacturing and prevent costly machine downtimes. I tell you, I’m too … Read More → "Agentic AI Prevents Costly Machine Downtime in Factories and Semiconductor Fabs"

New Auto Test Capability for the Analog Portions of SoCs

Ever since I began my career in electronics, analog has been the underdog compared to digital in the realm of automation. In the case of tools and techniques like fault simulation, test coverage, and automatic test pattern generation, the digital world has enjoyed robust support for decades. Meanwhile, analog has typically been relegated to handcrafted efforts and ad-hoc methods. Well, that imbalance just shifted in a dramatic … Read More → "New Auto Test Capability for the Analog Portions of SoCs"

SiTime Has Unleashed its Titan MEMS Resonators (Be Afraid, Be Very Afraid)

Apropos of nothing at all, I just read a definition of “engineer” that struck a chord. I understand that this was one of five options submitted to EE Times by their readers many moons ago. The definition in question reads as follows: “An engineer is someone who takes the creativity of an artist, the knowledge of a scientist, the imagination of a writer, and the stamina of … Read More → "SiTime Has Unleashed its Titan MEMS Resonators (Be Afraid, Be Very Afraid)"

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featured chalk talk

Accelerating BLDC Innovation Without the Complexity
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Scott from Qorvo and Amelia Dalton investigate how we can accelerate brushless DC innovation without complexity. They also discuss the trends behind the adoption of brushless DC motors, the challenges inherent in their design, and how Qorvo can help you streamline the journey from concept to production for your next brushless DC motor design. 
Sep 18, 2025
16,674 views

featured paper

Calibre Vision AI: A revolution in chip-level DRC debug using AI guided results analysis

Sponsored by Siemens Digital Industries Software

Calibre Vision AI transforms chip-level DRC debug with AI-driven analysis and compact OASIS format, enabling rapid root cause identification, faster iterations and actionable insights for today’s most complex IC designs.

Click here to read more

Libby's Lab

Libby's Lab Scopes out TE Connectivity E-motor Temperature Sensors

Sponsored by Mouser Electronics and TE Connectivity

Join Libby and Demo in this episode of “Libby’s Lab” as they explore the TE Connectivity e-motor temperature sensors, available at Mouser.com! These temperature sensors are great for a variety of motor-monitoring applications. Keep your circuits charged and your ideas sparking!

Click here for more information about TE Connectivity E-Motor Temperature Sensors

discussion
Posted on Sep 29 at 10:52am by Ryan @ Sundance
Great write up and explanation! There is room for a lot of OpenVPX hardware solutions to become optimized/expanded into these smaller formfactors. It is certainly interesting seeing how much compute can be pushed to the edge! The standard offers "fewer" slot profiles and combinations than OpenVPX did and SOSA ...
Posted on Sep 29 at 4:21am by ETION
Etion Create (https://etioncreate.co.za/products/) is leveraging the current knowledge in OpenVPX standards to provide a high reliability small form factor solution in the VNX+ format. The ETION Cheetah Tactical Router provides a VNX+ platform to survive military environments with 71degC operational temperatures. The SWAP-C requirement also forces ...
Posted on Sep 25 at 8:31am by Max Maxfield
A friend we'll call Adam (because that's his name) asked me: "Do these resonators still need the capacitive loading, or can that come off the board too?" I asked Eric at SiTime, who responded as follows: "The load capacitances are on-chip in 90% + of wireless SoCs and 32-bit ARM Cortex M ...
Posted on Sep 24 at 12:05pm by Max Maxfield
I passed your question on to SiTime. I just heard from Eric Garlepp, Sr. Director of Product Marketing | IoT, Mobile & Consumer. Eric says: "For our current standard CSP package, the nominal height is 0.46mm and the max height is 0.5mm. For co-packaging with other chips, we sell wafers (Known Good ...
Posted on Sep 24 at 5:55am by Max Maxfield
I don't know -- I'll ask the folks from SiTime to respond to your question.
Posted on Sep 24 at 5:12am by amond@ecmstockroom.com
What is the overall Height of the resonator?
Posted on Sep 16 at 9:40am by Max Maxfield
Thanks Flemming -- FYI I wrote a column on Zero ASIC's chiplet stuff: Is This the Future of Chiplet-Based Design? (https://www.eejournal.com/article/is-this-the-future-of-chiplet-based-design/). Also, although not 100% applicable here, Steve Leibson did a column on their open eFPGA IP: Is the world ready for Platypus, Zero ASIC’s ...
Posted on Sep 16 at 8:59am by Flemming.C@Sundance.com
Its’ true. The current high-end x86 CPUs and, even worse, the GPUs, take lots of power, as they are not targeted for embedded solutions. VITA90 (VNX+) is for small-form-factor solutions now Who picked the name “VNX+”, as not an upgrade to “VNX”?? Can somebody find the culprit, please? However, VITA90...
Posted on Sep 16 at 3:21am by ThomasPaine
Thermal designs handling 90W+ per VNX+ module are already out there. Cooling experts like EngineeringEntropy.co.uk are moving that limit all the time. Most modules in VNX+ target applications will need nothing like that amount of power, but well designed cooling also reduces wear and tear on devices. Extending ...
Posted on Sep 15 at 1:14pm by Max Maxfield
Very interesting -- thanks for sharing this -- I'll ask the folks at Sundance and Etion Create to respond.
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featured blogs
Sep 26, 2025
I recently ran across a video presenting 17 paradoxes that promised to change the way I see the universe. It didn't disappoint!...
Designing for R-290: Overcoming HVAC Component Challenges
In this episode of Chalk Talk, Paul Kramarz from Littelfuse and Amelia Dalton explore the what, where and how of R-290. They investigate the testing methods utilized for this kind of refrigerant and how Littelfuse is further innovation in this arena.
Oct 2, 2025
41 views
CUBE: Powering the AI Revolution
Sponsored by Winbond
In this episode of Chalk Talk, Omar Ma from Winbond and Amelia Dalton explore how we can power the AI revolution with CUBE. They also investigate how AI model parameters compare with DRAM density, why green DRAM can be a great solution for edge AI applications and how the CUBE can be scaled for implementation in a wide variety of applications including AI acceleration, AR/VR, smart cameras and more.
Sep 25, 2025
6,705 views
Single Pair Ethernet
In this episode of Chalk Talk, Tim Kurten from Cinch Connectivity Solutions and Amelia Dalton explore the what, where and how of single pair ethernet and how this technology is changing the landscape of smart building and industrial applications. They also investigate the different types of single pair ethernet and the benefits of Cinch Connectivity solutions in this arena.
Sep 23, 2025
9,493 views
BIOFUSE Tubing – Next Generation Heat Shrink Tubing Innovations
There is a greater demand today for sustainable solutions for electronic design than ever before. In this episode of Chalk Talk, Shane Lauth from TE Connectivity and Amelia Dalton explore the what, where, and how of heat shrink tubing. They also investigate the variety of benefits of TE Connectivity’s BIOFUSE heat shrink tubing and how this solution represents a lower environmental impact while maintaining the same price and performance of other TE Connectivity heat shrink tubing solutions.
Sep 19, 2025
13,644 views
Simplifying High Speed Interface Connections with Hirose’s AU1
Sponsored by Mouser Electronics and Hirose
In this episode of Chalk Talk, Nathan Moskal from Hirose and Amelia Dalton explore the benefits of Hirose’s AU1 connector and robust automotive features included in this solution. They also investigate how connector position assurance of this solution can assist with mis-mating and the variety of applications that can take advantage of AU1 connectors.
Sep 18, 2025
16,479 views
Infineon’s HV CoolGaN™ Bi-Directional Transistors
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Eric Persson from Infineon and Amelia Dalton explore the benefits of bidirectional switches and the cost and performance benefits of Infineon’s CoolGaN™ bi-directional switches. They also explore the applications where these kinds of bi-directional switches would be a good fit and where GaN bi-directional switch technology is headed in the future. 
Sep 16, 2025
16,119 views