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The Saturn Spectrum 300e2 Order Further Validates Ultratech's Technology Expertise and Leadership in the 300 mm Solder Bump Market SAN JOSE, Calif., Oct. 21 /PRNewswire-FirstCall/ -- Ultratech, Inc. (NASDAQ:UTEK) , a leading supplier of photolithography systems used to manufacture semiconductors and nanotechnology devices, today announced that it has received a follow-on order from Siliconware Precision Industries Co., Ltd. (NASDAQ:SPIL) for its award-winning 300 mm bump tool, the Saturn Spectrum 300e2. Recognized as a leading foundry for 300 mm wafer bumping, SPIL will use Ultratech's 300 mm advanced packaging lithography tool to solder bump high-end, field-programmable gate array (FPGA) and graphic chips. SPIL's follow-on order further solidifies Ultratech's technology expertise and product strength in the 300 mm solder bump market. SPIL chose Ultratech's 300 mm bump tool based on the success of its first Saturn Spectrum 300 system. The addition of the Saturn Spectrum 300e2 has enabled SPIL to provide the sophisticated packaging required for today's high-end FPGA and graphics components. Its decision to extend its partnership with Ultratech was based on the supplier's proven outstanding customer service, low cost of ownership and bump technology expertise. Stephen Kay, director, product marketing for Ultratech's Advanced Packaging Technology, noted, "Receiving a follow-on order from SPIL, an industry leader in 300 mm wafer bumping, offers further validation of Ultratech's expertise in advanced packaging technology. Furthermore, this is an example of how advanced packaging companies like SPIL can achieve industry success through the use of leading-edge technology such as the Saturn Spectrum 300e2. Ultratech looks forward to continuing its partnership with this valued customer and to ensuring SPIL meets its exacting requirements and manufacturing goals for high-end FPGA and graphic chips today, and in the future." Ultratech developed the Saturn Spectrum 300e2 in response to the growing industry need for thick photoresist-exposure capabilities. Tool options include a dual-lamp illuminator design and edge-processing capabilities tailored specifically to deliver the superior yield, imaging and throughput performance required for today's 300 mm bump and wafer-level packaging (WLP) applications. On July 16, Advanced Packaging magazine awarded Ultratech the 2003 Advanced Packaging Award for its Saturn Spectrum 300e2 stepper in the category of imaging/inspection. The products were judged specifically on their innovativeness, cost effectiveness, quality contribution, ease of use, maintainability/repairability, technical advancement and speed/throughput improvements. Certain of the statements contained herein may be considered forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as integration and development of the laser processing operation, the cyclicality in the semiconductor and nanotechnology industries, delays, deferrals and cancellations of orders by customers, pricing pressures, competition, lengthy sales cycles for the company's systems, ability to volume produce systems and meet customer requirements, the mix of products sold, dependence on new product introductions and commercial success of any new products, sole or limited sources of supply, international sales, customer concentration, manufacturing inefficiencies and absorption levels, risks associated with introducing new technologies, inventory obsolescence, economic and political conditions in Asia, delays in collecting accounts receivable, extended payment terms, changes in technologies, any adverse effects of terrorist attacks or military actions in the United States or elsewhere on the economy in general or our business in particular. Such risks and uncertainties are described in the company's SEC reports including the company's Annual Report on Form 10-K filed for the year ended December 31, 2002 and its Quarterly Report on Form 10-Q filed for the quarter ended June 28, 2003. About SPIL: Siliconware Precision Industries Ltd. ('SPIL') is a leading provider of comprehensive semiconductor assembly and test services. SPIL is dedicated to meeting all of its customers' integrated circuit packaging and testing requirements, with turnkey solutions that covers from design consultations, modeling and simulations, wafer bumping, wafer probe and sort, package assembly, final test, burn-in, through drop ship. Products include advanced leadframe and substrate packages, which are widely used in personal computers, communications, Internet appliances, cellular phones, digital cameras, cable modems, personal digital assistants and LCD monitors. SPIL supplies services and support to fabless design houses, integrated device manufacturers and wafer foundries globally. For further information, visit SPIL's web site at www.spil.com.tw About Ultratech: Founded in 1979, Ultratech, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductor and nanotechnology devices. The company produces products designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. Ultratech is a market leader in gold and solder bump lithography. The company's home page on the World Wide Web is located at www.ultratech.com Website: http://www.spil.com.tw/
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