BusinessWire
March 13, 2008 11:01 AM Pacific Daylight Time

Introducing a Collection of Cogently Written Articles by 49 Industry Experts on ‘Power Distribution Network Design Methodologies’

DUBLIN, Ireland--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/reports/c85901) has announced the addition of Power Distribution Network Design Methodologies to their offering.

"Power Distribution Network Design Methodologies" is a collection of cogently written articles by 49 industry experts that fills in the void on PDN design procedures, and addresses among others such related topics as DC-DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, synthesis of impedance profile. Through each of these contributions from such leading companies as SUN Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, the reader can come to understand why books on power-integrity are only now becoming available to the public and can relate these topics to current industry trends.

About the Author

Istvan Novak is a distinguished engineer of signal and power integrity at Sun Microsystems. He is a fellow of IEEE for his contributions to signal-integrity modeling, measurements, and simulations. Dr. Novak has been working on high-speed signaling and power distribution designs of Sun's V880, V480, V890, V490, T1000, T2000, T5120 and T5220 mid-range server families.

His new technology development work with laminate suppliers, printed-circuit fabricators and component vendors resulted in the introduction of the first sub 2-mil laminates and controlled-ESR bypass capacitors for Sun servers.

Dr. Novak developed a new validation methodology for the measurement of a wide range of power-distribution components, such as DC-DC converters, bypass capacitors and printed-circuit-board power-ground laminates. The methodology has been presented in several conference papers, two of which won the best paper awards.

Dr. Novak carries 24 years of international consulting and instructing experience, and 28 years of design experience in the field of high-speed and high-frequency circuits and systems. He is an international consultant and instructor with 30 years of experience in the field of high-speed and high-frequency circuits and systems. Dr. Novak holds 25 patents in power distribution, signal integrity, and digital signal processing, is the co-author of "Frequency-Domain Characterization of Power Distribution Networks," and he has published more than 100 technical papers.

Dr. Novak has worked and consulted for several companies in the computer and telecommunications industry, to do clock- and power-distribution networks, switching-mode converters as well as various high-speed backplanes, PCI buses, and copper and optical interconnects in the GB/s range.

Dr. Novak obtained his Ph.D. degree from the Hungarian Academy of Sciences, and he received his technical education from the Technical University of Budapest.

Chapters Include:

Part I

Chapter 1: Power Supply Compensation for Capacitive Loads

Jonathan L. Fasig, Principal Engineer, Mayo Clinic

Barry K. Gilbert, Director, Mayo Clinic

Erik S. Daniel, Deputy Director, Mayo Clinic

Chapter 2: DC-DC Converters: What is Wrong with Them?

Istvan Novak, Senior Signal Integrity Staff Engineer, Sun Microsystems

Chapter 3: The Advantage of Controlled-ESR Polymer Capacitators

Hideki Ishida, Design and Application Section Manager, Sanyo Electric Co.

Chaper 4: ESR-Controlled MLCCs and Decoupling Capacitor Network Design

Masaaki Togashi, Senior Development Engineer, TDK Corp.

Chris Burket, Senior Applications Engineer, TDK Corp.

Part II

Chapter 5: A Power Distribution System

K. Barry A. Williams, Principal Engineer, Hewlett-Packard

Chapter 6: Designing Minimum Cost VRM8.2/8.3 Compliant Converters

Richard Redl, President, ELFI S.A.

Brian Erisman, Project Engineer, Analog Devices, Inc.

Chapter 7: Frequency Domain Target Impedence Method for Bypass Capacitator Selection for Power Distribution Systems

Larry D. Smith, Principal Signal Integrity Engineer, Altena Corp.

Chapter 8: Resonant-Free Power Network Design Using Extended Adaptive Voltage Positioning Methodology

Alex Waizman, Principal Engineer, Intel Corp.

Chee-Yee Chung, Principal Engineer, Intel Corp.

Chapter 9: Distributed Matched Bypassing for Board-Level Power Distribution Networks

Istvan Novak, Senior Staff Engineer, Sun Microsystems

Leesa Noujeim, Staff Engineer, Sun Microsystems

Valerie St. Cyr, Supply Base Development Manager, Sun Microsystems

Nick Biunno, Principal Engineer, Sanmina-SCI

Atul Patel, Process Engineer, Sanmina-SCI

George Korony, Senior Member of Technical Staff, AVX Corp.

Andy Ritter, Senior Member of Technical Staff, AVX Corp.

Part III

Chapter 10: Comparison of Power Distribution Network Design Methods: An Approach to System-Level Power Distribution Analysis

Dale Becker, Senior Technical Staff Member, IBM Corp.

Chapter 11: Bypass Filter Design Considerations for Modern Digital Systems, a Comparative Evaluation of the Big "V," Multipole, and Many Pole Bypass Strategies

Steve Weir, Consultant, Teraspeed Consultant Group

Chapter 12: Comparison of Power Distribution Network Design Methods: Bypass Capacitator Selection Based on Time Domain and Frequency Domain Preferences

Istvan Novak, Senior Signal Integrity Staff Engineer, Sun Microsystems

Chapter 13: PDN Design Strategies: Ceramic SMT Decoupling Capacitators--What Values Should I Choose?

James L. Knighten, Senior Staff Engineer, NCR Corp.

Bruce Archambeault, Distinguished Engineer, IBM

Jun Fan, Senior Hardware Engineer, NCR Corp.

Giuseppe Selli, Ph.D. Candidate, University of Missouri-Rolla

Samuel Connor, Senior Engineer, IBM

James L. Drewniak, Professor, University of Missouri-Rolla

Part IV

Chapter 14: Power Integrity Analysis of DDR2 Memory Systems during Simultaneous Switching Events

Ralf Schmitt, Signal Integrity Engineer, Rambus, Inc.

Joong-Ho Kim, Signal Integrity Engineer, Rambus, Inc.

Chuck Yuan, Signal Integrity Engineer, Rambus, Inc.

June Feng, Signal Integrity Engineer, Rambus, Inc.

Woopoung Kim, Signal Integrity Engineer, Rambus, Inc.

Dan Oh, Signal Integrity Engineer, Rambus, Inc.

Chapter 15: Analysis of Supply Noise Induced Jitter in Gigabit I/O Interfaces

Ralf Schmitt, Signal Integrity Engineers, Rambus, Inc.

Hai Lan, Signal Integrity Engineer, Rambus, Inc.

Chris Madden, Signal Integrity Engineer, Rambus, Inc.

Chuck Yuan, Signal Integrity Engineer, Rambus, Inc.

Chapter 16: PCB Design Methods for Optimum FPGA SerDes Jitter Performance

Steve Weir, Consultant, Teraspeed Consulting Group

Steve McMorrow, President, Teraspeed Consulting Group

Al Neves, Consultant, Teraspeed Consulting Group

Tom Dagostino, Vice President, Teraspeed Consulting Group

Brian Vicich, Signal Integrity Engineer, Samtec, Inc.

Chapter 17: Power Distribution System Design

Mark Alexander, Senior Staff Engineer, Xilinx, Inc.

Part V

Chapter 18: Aperiodic Resonant Excitation of Microprocessor Power Distribution Systems and the Reverse Pulse Technique

Victor Drabkin, Senior Member of Technical Staff, Hewlett-Packard

Chris Houghton, Senior Member of Technical Staff, Hewlett-Packard

Isaac Kantorovich, Senior Member of Technical Staff, Hewlett-Packard

Michael Tsuk, Senior Member of Technical Staff, Hewlett-Packard

Chapter 19: Modeling Noise on Printed Circuit Board Power Planes

John Grebenkemper, Ph.D., Development Engineering Manager, Hewlett-Packard

Chapter 20: Toward Developing a Standard for Data Input/Output Format for PDN Modeling and Simulation Tools

Ravi Kaw, Senior Staff Engineer, Agilent Technologies, Inc.

Istvan Novak, Senior Staff Engineer, Sun Microsystems

Madhawan Swaminathan, Professor, Georgia Institute of Technology

Chapter 21: Overview of Frequency Domain Power Distribution Measurements

Istvan Novak, Senior Signal Integrity Staff Engineer, Sun Microsystems

Chapter 22: Simple Transmission Line Causal Model for Multilayer Ceramic Capacitators

Istvan Novak, Senior Staff Engineer, Sun Microsystems

Gustavo Blando, Staff Engineer, Sun Microsystems

Jason R. Miller, Senior Staff Engineer, Sun Microsystems

Companies Mentioned:

- Agilent Technologies

- Altena Corporation

- Analog Devices, Inc.

- AVX Corporation

- ELFI S.A.

- Georgia Institute of Technology

- Hewlett-Packard

- IBM

- Intel

- Mayo Clinic

- NCR

- Rambus, Inc.

- Samtec, Inc.

- Sanmina-SCI

- Sanyo Electric Co.

- Sun Microsystems

- TDK Corp.

- Teraspeed Consulting Group

- University of Missouri-Rolla

- Xilinx, Inc.

For more information visit http://www.researchandmarkets.com/reports/c85901