BusinessWire
January 31, 2008 09:13 AM Pacific Time

Ethernet Alliance and other Professional Societies Partner with IEC at DesignCon 2008 Next Week in Santa Clara

The Ethernet Alliance will demonstrate Backplane Ethernet with its member companies next week at the DesignCon 2008 exhibition in the Santa Clara Convention Center in Santa Clara, CA

DesignCon 2008

CHICAGO--(BUSINESS WIRE)--The International Engineering Consortium (IEC) prepares for DesignCon 2008 next week at the Santa Clara Convention Center with key industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance (GSA), the IBIS Open Forum, the International Disk Drive Equipment and Materials Association (IDEMA), Microelectronics Packaging and Test Engineering Council (MEPTEC), SEMI and the Silicon Integration Initiative, Inc. (Si2).

“It will be an exciting time at DesignCon as these respectable organizations gather their members at DesignCon and share cutting-edge demonstrations with attendees on the exhibition floor,” commented IEC President John Janowiak. “For example, we’re pleased that the Ethernet Alliance and its member companies will demonstrate 10GbE Backplane Ethernet, which will showcase live traffic using streaming video and signal quality shown through a bit error rate.”

Ethernet Alliance member companies participating in the demonstration include AMCC, Molex, Tyco Electronics and Vitesse. Ethernet Alliance members and executives will also participate in the DesignCon 2008 educational program in panel sessions discussing 100GbE, 10+Gb signaling and next-generation electrical signaling.

Mr. Brad Booth, president of the Ethernet Alliance further commented, "We look forward to continuing to promote Ethernet education at DesignCon 2008 and informing potential new members of the benefits and opportunities available to them as Ethernet Alliance members."

The Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum will each hold co-located events at DesignCon 2008 next week.

The DesignCon 2008 exhibition will host more than 135 exhibitors and sponsors such as Official Host Sponsor Agilent Technologies, Rambus, LeCroy, Tektronix, BERTScope, WIPRO, Amphenol, Cisco, Hewlett-Packard, IBM, Intel, Redback Networks, Sun Microsystems, Xilinx and more.

Exhibiting companies will present EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, RF and signal integrity technologies and more.

More than 300 experts, 120 premier educational sessions and the Business Forum make up the educational conference, which will complement the exciting exhibition next week.

Visit www.designcon.com/2008/ for full information or contact Lisa Reyes at lreyes@iec.org or +1-312-559-3325.